發(fā)布時(shí)間：2018-07-20 13:38

【摘要】：針對(duì)數(shù)據(jù)機(jī)房密度越來(lái)越高的發(fā)展趨勢(shì),提出了水冷背板的散熱解決方案。以某高密度數(shù)據(jù)機(jī)房(單機(jī)柜密度高達(dá)35kW)項(xiàng)目為例,從初投資、占地面積、電耗效率、能耗等方面,與常用的行間制冷方案進(jìn)行了詳細(xì)的對(duì)比分析,得出了水冷背板散熱解決方案具有明顯優(yōu)勢(shì)的結(jié)論,并展望了水冷背板散熱方案的應(yīng)用前景。
[Abstract]:In view of the increasing density of the data computer room, the heat dissipation solution of the water-cooled backplane is put forward. Taking the project of a high density data room (single cabinet density as high as 35kW) as an example, this paper makes a detailed comparison and analysis with common interline refrigeration schemes from the aspects of initial investment, occupation area, power consumption efficiency, energy consumption, etc. The conclusion that the solution of water-cooled backboard has obvious advantages is obtained, and the application prospect of water-cooled backboard heat dissipation scheme is prospected.
【作者單位】： 華為技術(shù)有限公司;
【分類(lèi)號(hào)】：TP308
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本文編號(hào)：2133721